Spin Sonic Cleaning System

Even Submicron Particles on Wafers Can Be
Simultaneously Removed from Both Wafer Sides via
Non-Contact Cleaning

The Spin Sonic Cleaning System has realized high cleaning performance through Chemical-Fine-Jet and ED-Jet technology for horizontally placed wafers. The system can remove even submicron particles.
Chemical control and heating are no longer necessary as several processes have been eliminated.
Excellent cost performance is realized by reducing the cleaning time and the operational costs.

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Features

High cleaning performance through Chemical Fine-Jet and 400kHz Fine-Jet technology.

Non-contact cleaning (blushless) protects wafer surface.

All the cleaning and drying process is conducted in a single chamber.

Cleaning process in the total room temperature needs no heater and promises big reduction in electricity consumption.

Components arrangement by function minimizes foot print and realizes a flexible layout.

Applications

Post/Pre epitaxial process.

Post CMP Cleaning.

Post polishing.

Pre Annealing.

Post/Pre Cleaning for CVD, nitride film, oxide film and etc.

Efficiency much improved with the leading-edge Super Clean System

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Spin chamber

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Fine jet nozzle

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Fine jet generator

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Chemical dispensing unit

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Transfer robot

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Loading/unloading unit

Example of the cleaning process of a Spin Sonic Cleaning System

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