Smooth robotized transfer without chipping considerably reduces the operational costs.
Cleaning quality is much improved using FINE-SONIC.
Cassette-less cleaning equipment, which uses several advanced super-clean technologies, resolves all previous cassette-related issues for semiconductor (wafer) cleaning.
Maintaining consistency in cleaning for the cassette contact part.
Little amount of chemicals in a bath enhances finer cleaning.
Big reduction in electricity consumption.
Cut back chemicals when wafers transferring between baths.
Fine-Sonic devices(high-frequency generator/transducer) enhance particle removal efficiency without any damage to wafers.